The etching operation is needed to obtain a surface finish free from any impurity.
Some characteristics of the installation
- mixture of phosphoric, nitric and hydrofluoric acids
- average etching rate : 0.5 µm/minute
- typical etching depth : from 10 to 250 µm
- evacuation and recycling unit of the toxic gase emissions and liquid effluents
Surface observation capabilities
- ultrasonic probe (local depth measurement)
- roughness meter
- optical microscope (×1000)